Composition for removing an insulation material and related methods

ABSTRACT

A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.

CROSS-REFERENCE TO RELATED APPLICATION

This is a divisional of application Ser. No. 11/500,434 filed on Aug. 8,2006, which is incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Exemplary embodiments of the present invention relate to a compositionfor removing an insulation material, and related methods. In particular,exemplary embodiments of the present invention relate to a compositionfor removing an insulation material that may effectively remove a low-kfilm and a protection film with reduced damage to a substrate on whichthe films are formed, a method of removing an insulation layer, and amethod of recycling a substrate.

This application claims priority to Korean Patent Application No.2005-72471, filed on Aug. 8, 2005, the subject matter of which is herebyincorporated by reference in its entirety.

2. Description of the Related Art

A demand for semiconductor devices having greater integration densitiesand higher operating speeds has existed throughout the decades longdevelopment of various information processing apparatuses. Thus,developments in semiconductor device fabrication technologies have beendirected towards increasing integration, improved reliability, andobtaining higher operating speeds.

As integration densities for semiconductor devices have increased, therespective design rules for semiconductor devices have decreased.Contemporary design rules include, for example, wiring widths of about100 nm or less. However, as design rules have decreased, RC delay timeshave increased for wirings and other elements formed according to thedecreased design rules. An RC delay time is determined in accordancewith the resistance (R) of (e.g.,) a wire and the capacitance (C) of aninsulation layer disposed between adjacent wires. An increased RC delaytime causes a reduction in semiconductor device operating speed.Therefore, to obtain a semiconductor device having greater integrationdensity and a fast operating speed, either the resistance of the wiringor the dielectric constant (k) of the insulation layer must be reduced.

To reduce the wiring resistance, a conductive material having a lowresistivity has been used to form the wiring. For example, a fabricationprocess has been developed that forms wiring from copper instead ofaluminum, since copper has a substantially lower resistivity thanaluminum.

An insulation material having a low dielectric constant is also usefulin achieving a reduced RC delay time. In a conventional semiconductordevice, the insulation layer is generally formed from silicon oxidehaving a dielectric constant of about 3.9. As the thickness of theinsulation layer is reduced, a silicon oxide insulation layer does noteffectively isolate adjacent wires, and parasitic capacitance may formbetween adjacent wires. Therefore, low-k materials having a dielectricconstant substantially lower than that of silicon oxide have beendeveloped.

The low-k materials generally have a dielectric constant less than orequal to about 3. Low-k materials may generally be divided into organiclow-k materials and inorganic low-k materials, but organic low-kmaterials are more commonly used in conventional practice. Carbon-dopedsilicon oxide (SiOCH), silicon oxycarbide (SiOC), hydrogenated siliconoxide (SiOH), BLACK DIAMOND™, methylsilsesquioxane (MSQ), fluorinatedsilicate glass (FSG), organic silicate glass (OSG), etc., are examplesof organic low-k materials.

When an insulation layer is formed using low-k material, the insulationlayer may be easily damaged by plasma based fabrication processessubsequently applied to semiconductor devices, such as those commonlyused in dry etching processes. Furthermore, the insulation layer formedusing low-k material may be porous. A porous insulation layer readilyabsorbs moisture through the pores, which deteriorates the insulationlayer. Thus, a protection layer is generally formed on the insulationlayer to prevent deterioration of the insulation layer. The protectionlayer is formed from a substance such as silicon carbonitride (SiCN),silicon nitride (SiN), silicon carbide (SiC), etc. Additionally, theprotection layer may be used as a capping layer formed on a conductivematerial.

Between and among the lengthy sequence of fabrication processesnecessary to form semiconductor devices on a wafer, various inspectionprocesses are performed. For example, when processing a wafer, eachprocess performed on the wafer may also be performed on a dummy wafer,so that, after each process is performed, the thickness andcharacteristics of a layer formed on the wafer may be estimated usingthe dummy wafer.

Once a dummy wafer has been used, it may be recycled through a recyclingprocess or discarded; however, recycling the dummy wafer is economicallyadvantageous. This is particularly true of late as commercial wafershave diameters of about 300 mm. These very large wafers are expensiveand, thus, recycling dummy wafers become more necessary.

When forming a low-k material layer and/or a protection layer on awafer, a dummy wafer is used along side the wafer. After performing aninspection process on the dummy wafer, the low-k material layer and/orthe protection layer may then be removed from the dummy wafer.

The low-k material layer and/or the protection layer are removed througha dry etching process or a wet etching process. A dry etching processmay be performed using plasma, and a wet etching process may beperformed using an etching solution. For example, U.S. Pat. No.6,890,391, discloses a method for removing a low-k material layer and aprotection layer using a dry etching process. In the disclosed method,the low-k material layer is formed from silicon oxide,methylsilsesquioxane (MSQ), hydrosilsesquioxane (HSQ), siliconoxycarbide (SiOC) or carbon-doped silicon oxide (SiOCH), and theprotection layer is formed using silicon nitride (SiN) or siliconcarbonitride (SiCN). Also, Japanese Laid-Open Patent Publication No.2001-65459 discloses a method of dry etching a low-k material layercomprising silicon oxycarbide (SiOC) using a mixture gases comprisingfluorinated carbon gas, nitrogen gas, and an inert gas having a flowrate greater than or equal to about 80%. In addition, Korean Laid-OpenPatent Publication No. 2004-102981 discloses a method of removing aninsulating interlayer through a plasma etching process using a mixturegas of CF₄/O₂/Ar. In the disclosed method, the insulating interlayercomprises an oxide layer, an organic low-k material layer, an organicporous low-k layer, or a combination thereof.

In the above methods of removing the low-k layer and/or the protectionlayer through a dry etching process, plasma having a high energy leveldamages the layer underneath the low-k layer and/or the protectionlayer. Furthermore, recycling a dummy wafer from which a low-k layerand/or a protection layer has been removed using a dry etching processis not economically advantageous.

Korean Laid-Open Patent Publication No. 2002-55888 discloses a method ofmanufacturing a metal wiring and a capacitor in a semiconductor device.In the disclosed method, an insulation layer formed using silicon oxide,fluorinated silicate glass (FSG), carbon-doped silicon oxide (SiOCH),silicon oxycarbide (SiOC), or hydrogenated silicon oxide (SiOH) isremoved using a hydrogen fluoride solution. However, the hydrogenfluoride solution does not sufficiently remove the low-k material fromthe object on which it is formed. Furthermore, the hydrogen fluoridesolution etches a protection material such as silicon carbonitride(SiCN) very little.

Japanese Laid-Open Patent Publication No. 2002-246378 discloses a methodof selectively etching a silicon nitride layer and a silicon oxynitridelayer using an etching solution relative to a silicon wafer or a siliconoxide layer. In the disclosed method, the etching solution comprisessulfuric acid, ammonium fluoride (or hydrogen fluoride), and less thanor equal to about 5 percent by weight of water. The etching process isperformed at a temperature greater than or equal to about 150° C.Furthermore, the etching solution comprises excessive sulfuric acid.Thus, etching rates of the silicon nitride layer and the siliconoxynitride layer are not easily controlled, and the stability of theetching solution is reduced.

The subject matter of these background documents is hereby incorporatedby reference.

SUMMARY OF THE INVENTION

Exemplary embodiments of the present invention provide a composition forremoving an insulation layer without damaging a substrate on which theinsulation layer is formed and related methods.

In one embodiment, the invention provides a composition for removing aninsulation material comprising about 1 to 50 percent by weight of anoxidizing agent, about 0.1 to 35 percent by weight of afluorine-containing compound, and water, wherein the insulation materialcomprises at least one of a low-k material and a protection material.

In another embodiment, the invention provides a composition for removingan insulation material comprising about 1 to 50 percent by weight of atleast one peroxy acid compound selected from the group consisting ofammonium persulfate, sodium persulfate, potassium persulfate,peroxynitric acid, peroxyphosphoric acid, peroxysulfuric acid,peroxyboric acid, sodium peroxyborate, peroxyformic acid, peroxyaceticacid, peroxybenzoic acid, and peroxyphthalic acid. The compositionfurther comprises about 0.1 to 35 percent by weight of afluorine-containing compound, and water.

In yet another embodiment, the invention provides a method of removingan insulation layer from an object, the insulation layer comprising atleast one of a low-k material and a protection material, the methodcomprising removing the insulation layer from the object by applying tothe object a composition comprising about 1 to 50 percent by weight ofan oxidizing agent, about 0.1 to 35 percent by weight of afluorine-containing compound, and water.

In still another embodiment, the invention provides a method ofrecycling a substrate comprising forming an insulation layer on thesubstrate using at least one of a low-k material and a protectionmaterial, and removing the insulation layer from the substrate byapplying to the substrate a composition comprising about 1 to 50 percentby weight of an oxidizing agent, about 0.1 to 35 percent by weight of afluorine-containing compound, and water.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will be described with reference to theaccompanying drawings, in which like reference symbols refer to like orsimilar elements. In the drawings:

FIG. 1 is a flow chart illustrating a method of removing an insulationlayer using a composition in accordance with an embodiment of theinvention;

FIGS. 2 through 4 are cross-sectional views illustrating a method ofrecycling a substrate using a composition in accordance with anembodiment of the invention;

FIG. 5 is an SEM picture showing a surface of a substrate from which asilicon carbonitride (SiCN) film was removed using the compositionprepared in Example 1; and,

FIG. 6 is an SEM picture showing a surface of a substrate after thecomposition prepared in Comparative Example 1 was applied to thesubstrate, on which a silicon carbonitride (SiCN) film was formed.

DESCRIPTION OF EMBODIMENTS

In the drawings, the sizes and relative sizes of layers and regions maybe exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer, itcan be directly on, connected, or coupled to the other element or layer;or intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

It will be understood that, although the terms first, second, third,etc., may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers and/or sections should not be limited by these terms. These termsare only used to distinguish one element, component, region, layer, orsection from another element, component, region, layer, or section.Thus, a first element, component, region, layer, or section discussedbelow could be called a second element, component, region, layer, orsection, respectively, without departing from the scope of the presentinvention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

Composition for Removing an Insulation Material

A composition for removing an insulation material, in accordance with anembodiment of the invention, may remove an insulation layer from asubstrate without damaging the substrate. In particular, the compositionmay effectively remove a low-k film and/or a protection film from thesubstrate without damaging the substrate. The low-k film may be formedusing a low-k material such as carbon-doped silicon oxide (SiOCH),silicon oxycarbide (SiOC), hydrogenated silicon oxide (SiOH), and thelike. The protection film may be formed using a protection material suchas silicon carbonitride (SiCN), silicon nitride (SiN), silicon carbide(SiC), etc.

A composition in accordance with an embodiment of the invention, whichhas the characteristics described above, comprises about 1 to 50 percentby weight of an oxidizing agent, about 0.1 to 35 percent by weight of afluorine-containing compound, and a remainder of water. As used herein,percent or percentage “by weight” means the percent or percentage of thetotal weight of the resulting composition.

The oxidizing agent of the composition may react with the low-k materialand the protection material to generate silicon oxide. The low-kmaterial may be, for example, carbon-doped silicon oxide (SiOCH),silicon oxycarbide (SiOC), hydrogenated silicon oxide (SiOH), etc., or acombination thereof, and the protection material may be, for example,silicon carbonitride (SiCN), silicon nitride (SiN), silicon carbide(SiC), etc., or a combination thereof. As an example, the oxidizingagent may be reacted with silicon carbonitride as shown in the followingchemical equation.

SiCN+Oxidizing Agent→SiO₂+Byproducts  (1)

The reaction of the oxidizing agent with silicon carbonitride generatessilicon oxide and byproducts. The byproducts may be readily removed fromthe substrate.

When a composition comprises about 0.1 to 35 percent by weight of afluorine-containing compound, water, and less than about 1 percent byweight of the oxidizing agent, the composition may not have a sufficientoxidizing ability, and processing time may increase. In addition, when acomposition comprises about 0.1 to 35 percent by weight of afluorine-containing compound, water, and greater than about 50 percentby weight of the oxidizing agent, the oxidizing agent may not completelydissolve in the water. Thus, a composition in accordance with anembodiment of the invention comprises about 1 to 50 percent by weight ofthe oxidizing agent, and preferably about 5 to 30 percent by weight ofthe oxidizing agent.

The oxidizing agent of a composition in accordance with an embodiment ofthe invention, may be, for example, a peroxy acid compound, a peroxidecompound, an oxy acid compound, a metal salt, an acid, etc., or acombination thereof.

The peroxy acid compound may be, for example, ammonium persulfate,sodium persulfate, potassium persulfate, peroxynitric acid,peroxyphosphoric acid, peroxysulfuric acid, peroxyboric acid, sodiumperoxyborate, peroxyformic acid, peroxyacetic acid, peroxybenzoic acid,peroxyphthalic acid, etc., or a combination thereof.

The peroxide compound may be, for example, hydrogen peroxide, sodiumperoxide, barium peroxide, etc., or a combination thereof.

The oxy acid compound may be, for example, nitric acid, phosphoric acid,chloric acid, hypochlorous acid, sulfuric acid, permanganic acid,chromic acid, dichromic acid, bromic acid, hypobromic acid, iodic acid,hypoiodic acid, or a salt thereof. The oxy acid compound may also be,for example, a combination of the substances listed above with referenceto the oxy acid compound.

The metal salt may be, for example, iron(III) chloride, iron(III)sulfate, iron(III) citrate, ammonium iron(III) sulfate, etc., or acombination thereof. The acid may be, for example, acetic acid,hydrochloric acid, etc., or a combination thereof.

In an embodiment of the invention, the oxidizing agent may comprise aperoxy acid compound, which comprises ammonium persulfate, sodiumpersulfate, potassium persulfate, or a combination thereof.

The fluorine-containing compound of a composition in accordance with anembodiment of the invention may react with silicon oxide to removesilicon oxide from the substrate. For example, hydrogen fluoride mayreact with silicon oxide as shown in the following chemical equation.

6HF+2SiO₂→Si₂F₆O+3H₂O  (2)

When a composition comprises about 1 to 50 percent by weight of anoxidizing agent, water, and less than about 0.1 percent by weight of thefluorine-containing compound, the ability of the composition to removesilicon oxide may be relatively poor, and processing time may beincreased. In addition, when a composition comprises about 1 to 50percent by weight of an oxidizing agent, water, and greater than about35 percent by weight of the fluorine-containing compound, a siliconsubstrate may be damaged when the composition is used on the substrate,and disposal of the waste composition may be limited because thefluorine-containing compound is regulated as hazardous waste. Thus, acomposition in accordance with an embodiment of the invention comprisesabout 0.1 to 35 percent by weight of the fluorine-containing compound,and preferably about 1 to 20 percent by weight of thefluorine-containing compound.

The fluorine-containing compound of a composition in accordance with anembodiment of the invention may be, for example, hydrogen fluoride,ammonium fluoride, ammonium bifluoride, sodium fluoride, sodium hydrogenfluoride, barium fluoride, potassium fluoride, ammonium fluoroborate,etc., or a combination thereof.

In an embodiment of the invention, the composition may comprise hydrogenfluoride as the fluorine-containing compound.

A composition in accordance with an embodiment of the invention alsocomprises water. The water may be, for example, pure water, deionizedwater, ultra pure water, etc., or a combination thereof.

A composition in accordance with an embodiment of the invention is usedfor removing a low-k material and/or a protection material (or apassivation material). The low-k material may be, for example,carbon-doped silicon oxide (SiOCH), silicon oxycarbide (SiOC),hydrogenated silicon oxide (SiOH), or a combination thereof.Particularly, a composition in accordance with an embodiment of theinvention may effectively remove carbon-doped silicon oxide (SiOCH).

The protection material may be, for example, silicon carbonitride(SiCN), silicon nitride (SiN), silicon carbide (SiC), or a combinationthereof. Additionally, a composition in accordance with an embodiment ofthe invention may effectively remove silicon carbonitride (SiCN). Thesilicon carbonitride (SiCN) is conventionally removed through a dryetching process, and an etching solution is not typically used forremoving silicon carbonitride (SiCN). However, a composition inaccordance with an embodiment of the invention may be used for removingsilicon carbonitride (SiCN).

In an embodiment of the invention, the composition for removing aninsulation material comprises about 1 to 50 percent by weight of anperoxy acid compound, about 0.1 to 35 percent by weight of afluorine-containing compound, and a remainder of water. The peroxy acidcompound may be, for example, ammonium persulfate, sodium persulfate,potassium persulfate, peroxynitric acid, peroxyphosphoric acid,peroxysulfuric acid, peroxyboric acid, sodium peroxyborate, peroxyformicacid, peroxyacetic acid, peroxybenzoic acid, peroxyphthalic acid, andthe like, or a combination thereof. The composition may effectivelyremove the insulation material such as a low-k material and/or aprotection material. Particularly, the composition may advantageouslyremove silicon carbonitride (SiCN).

Method of Removing an Insulation Layer

FIG. 1 is a flow chart illustrating a method of removing an insulationlayer from an object using a composition in accordance with anembodiment of the invention.

Referring to FIG. 1, the method comprises preparing a composition inaccordance with an embodiment of the invention, wherein the compositioncomprises about 1 to 50 percent by weight of an oxidizing agent, about0.1 to 35 percent by weight of a fluorine-containing compound, and aremainder of water (S110).

A composition in accordance with an embodiment of the invention isprepared by mixing about 1 to 50 percent by weight of an oxidizingagent, about 0.1 to 35 percent by weight of a fluorine-containingcompound, and a remainder of water using a stirrer or a circulationsystem. The composition has been described previously, so furtherdescription of the composition will be omitted here.

Then, the insulation layer formed using a low-k material and/or aprotection material is removed from the object by applying thecomposition to the object (S120). The low-k material and the protectionmaterial have been described previously, so description of thosematerials will be omitted here.

The object may be, for example, a substrate or a substrate on which alower structure is formed. The substrate may be, for example, a siliconwafer, a silicon-on-insulator (SOI) substrate, etc. The lower structuremay be, for example, a gate, a wiring, a capacitor, a contact, a pad, aplug, etc.

The insulation layer may comprise a low-k film comprising the low-kmaterial, a protection film comprising the protection material, or acombination thereof. In an embodiment of the invention, the insulationlayer comprises a low-k film and a protection film formed on the low-kfilm. As an example, the insulation layer may comprise a low-k filmformed using carbon-doped silicon oxide (SiOCH) and a protection filmformed on the low-k film using silicon carbonitride (SiCN). When acomposition in accordance with an embodiment of the invention is appliedto the object on which the insulation layer is formed, the oxidizingagent and the fluorine-containing compound may react with the low-kmaterial and the protection material to simultaneously remove the low-kfilm and the protection film from the object.

Particularly, the oxidizing agent of the composition may react with thelow-k material and the protection material to generate silicon oxide.Furthermore, the fluorine-containing compound of the composition maydecompose the generated silicon oxide and remove it from the object.When those processes occur, the insulation layer is removed from theobject as a result those processes.

The composition is applied to the object using a batch-type etchingapparatus or a single-type etching apparatus.

When the temperature of the composition applied to the object is lowerthan about 15° C., the processing time needed to remove the insulationlayer may increase excessively. In addition, when the temperature of thecomposition is higher than about 100° C., the rate at which theinsulation layer is etched may not be readily controlled and thus theobject, such as a silicon wafer, may be damaged by the composition.Therefore, when applied to the object, the composition preferably has atemperature of about 15° C. to 100° C., and more preferably has atemperature of about 40° C. to 90° C.

Next, whether or not the insulation layer has been removed from theobject is determined using the naked eye or an electronic microscope(S130). When the insulation layer has not been completely removed fromthe object, the composition is applied to the object again to completelyremove the insulation layer from the object.

Therefore, the insulation layer comprising the low-k film and/or theprotection film may be effectively removed from the object using acomposition in accordance with an embodiment of the invention.

Method of Recycling a Substrate

FIGS. 2 through 4 are cross-sectional views illustrating a method ofrecycling a substrate using a composition in accordance with anembodiment of the invention.

FIG. 2 is a cross-sectional view illustrating a step of forming aninsulation layer 200 on a substrate 100. FIG. 3 is a cross-sectionalview illustrating insulation layer 200 of FIG. 2.

Referring to FIG. 2, insulation layer 200 is formed on substrate 100.Substrate 100 may be, for example, a silicon wafer or asilicon-on-insulator (SOI) substrate.

Insulation layer 200 may comprise a low-k film, a protection film, or acombination thereof. The low-k film may be formed using a low-kmaterial. For example, the low-k film may be formed using carbon-dopedsilicon oxide (SiOCH). The protection film may be formed using aprotection material. For example, the protection film may be formedusing silicon carbonitride (SiCN).

In the illustrated embodiment of FIG. 3, insulation layer 200 compriseslow-k film 210 and protection film 220 formed on low-k film 210. As anexample, the insulation layer may comprise low-k film 210 formed usingcarbon-doped silicon oxide (SiOCH), and protection film 220 formed onlow-k film 210 using silicon carbonitride (SiCN).

FIG. 4 is a cross-sectional view illustrating a step of removinginsulation layer 200 from substrate 100 using a composition inaccordance with an embodiment of the invention.

Referring to FIG. 4, insulation layer 200 is removed from substrate 100by applying the composition to substrate 100.

In more detail, a composition comprising about 1 to 50 percent by weightof an oxidizing agent, about 0.1 to 35 percent by weight of afluorine-containing compound, and a remainder of water is applied tosubstrate 100 on which insulation layer 200 is formed. The compositionhas been described previously, so further description of the compositionwill be omitted here.

When a composition in accordance with an embodiment of the invention isapplied to substrate 100 on which insulation layer 200 is formed, theoxidizing agent of the composition may react with the low-k material andthe protection material to generate silicon oxide. Furthermore, thefluorine-containing compound of the composition may decompose thegenerated silicon oxide to remove insulation layer 200 from substrate100.

When insulation layer 200 comprises low-k film 210 and protection film220 formed on low-k film 210 in accordance with an embodiment of theinvention, low-k film 210 and protection film 220 are simultaneouslyremoved from substrate 100.

Additionally, substrate 100 may be rinsed using pure water so thatremaining composition and other residuals may be removed from substrate100. Further, substrate 100 may be dried so that remaining water may beremoved from substrate 100.

The method of removing insulation layer 200 has been describedpreviously with reference to FIG. 1, so further explanation of thatprocess will be omitted here.

Substrate 100 may be economically recycled (i.e., cost-effectivelyrecycled) by removing insulation layer 200 from substrate 100 using acomposition in accordance with an embodiment of the invention.Insulation layer 200 is removed through a wet etching process to preventthe damage that a dry etching process causes to substrate 100.Therefore, the cost of a semiconductor manufacturing process may bereduced and process efficiency may be increased.

Compositions, in accordance with embodiments of the invention, which areused for removing an insulation material, will be described hereinafterwith reference to “Examples” and in comparison to a “ComparativeExample”. Evaluations of the performances of the compositions will alsobe described.

Preparation of a Composition for Removing an Insulation Material Example1

A composition for removing an insulation material was prepared by mixingabout 10 percent by weight of hydrogen fluoride, about 10 percent byweight of ammonium persulfate, and a remainder of pure water, based onthe total weight of the composition. The temperature of the compositionwas maintained at about 50° C.

Examples 2 through 13

Compositions for removing an insulation material were prepared throughprocesses substantially the same as those for forming Example 1 exceptfor the type, or the types and total percentage by weight, of theoxidizing agent(s) in each composition. For each of Examples 1 through37, Table 1 shows the type(s) and percentage(s) by weight of theoxidizing agent(s) and the fluorine-containing compound used in eachexemplary composition, and the temperature of each exemplarycomposition.

Examples 14 through 37

Compositions for removing an insulation material were prepared throughprocesses substantially the same as those for forming Example 1 exceptthat, for each composition, one or more of the following was varied: thetype of oxidizing agent, the type of fluorine-containing compound, thepercentage by weight of oxidizing agent, the percentage by weight offluorine-containing compound, and the composition temperature.

Comparative Example 1

A composition for removing an insulation layer was prepared by mixingabout 10 percent by weight of hydrogen fluoride and a remainder of purewater. The temperature of the composition was maintained at about 50° C.For Comparative Example 1, Table 1 shows the type and percentage byweight of the fluorine-containing compound, the temperature of thecomposition, and the fact that the composition contained no oxidizingagent.

TABLE 1 Fluorine- Containing Compound Oxidizing Agent Temperature [wt %][wt %] [° C.] Example 1 HF 10 (NH₄)₂S₂O₈ 10 50 Example 2 HF 10 H₂O₂ 1050 Example 3 HF 10 HNO₃ 10 50 Example 4 HF 10 H₂SO₄ 10 50 Example 5 HF10 H₃PO₄ 10 50 Example 6 HF 10 HClO₄ 10 50 Example 7 HF 10 FeCl₃ 10 50Example 8 HF 10 CH₃COOH 10 50 Example 9 HF 10 H₂O₂ 10 50 HNO₃ 10 Example10 HF 10 H₂O₂ 10 50 H₂SO₄ 10 Example 11 HF 10 H₂O₂ 10 50 H₃PO₄ 10Example 12 HF 10 HNO₃ 10 50 H₂SO₄ 10 Example 13 HF 10 HNO₃ 10 50 HCl 10Example 14 HF 5 H₂O₂ 10 80 Example 15 HF 10 H₂O₂ 10 80 Example 16 HF 10HNO₃ 10 80 Example 17 HF 10 H₂SO₄ 10 80 Example 18 HF 1 (NH₄)₂S₂O₈ 10 80Example 19 HF 5 (NH₄)₂S₂O₈ 10 80 Example 20 HF 10 (NH₄)₂S₂O₈ 10 80Example 21 HF 20 (NH₄)₂S₂O₈ 10 80 Example 22 HF 30 (NH₄)₂S₂O₈ 10 80Example 23 HF 10 (NH₄)₂S₂O₈ 2 80 Example 24 HF 10 (NH₄)₂S₂O₈ 5 80Example 25 HF 10 (NH₄)₂S₂O₈ 10 80 Example 26 HF 10 (NH₄)₂S₂O₈ 20 80Example 27 HF 10 (NH₄)₂S₂O₈ 30 80 Example 28 HF 10 (NH₄)₂S₂O₈ 35 80Example 29 HF 10 (NH₄)₂S₂O₈ 10 70 Example 30 HF 10 (NH₄)₂S₂O₈ 20 70Example 31 HF 10 (NH₄)₂S₂O₈ 30 70 Example 32 HF 10 Na₂S₂O₈ 7 70 Example33 HF 10 K₂S₂O₈ 7 70 Example 34 HF 10 (NH₄)₂S₂O₈ 20 50 Example 35 HF 10(NH₄)₂S₂O₈ 30 50 Example 36 NH₄F 10 (NH₄)₂S₂O₈ 30 50 Example 37 NH₄F•HF10 (NH₄)₂S₂O₈ 30 50 Comparative HF 10 — — 50 Example 1

Evaluation of Insulation Layer Removal Rate in Accordance with theOxidizing Agent

The rates at which the compositions in Examples 1 through 13 andComparative Example 1 removed insulation layers were evaluated.

In the compositions prepared in Examples 1 through 13 and ComparativeExample 1, a similar amount (about 10 percent by weight) of hydrogenfluoride was used as the fluorine-containing compound in eachcomposition, but the presence of an oxidizing agent, and, if present,the type, or types and total amounts, of the oxidizing agent(s) variedamong the compositions. Furthermore, the temperatures of thecompositions were maintained at about 50° C. using a thermostat.

Insulation layer removal rates were evaluated using a low-k film and aprotection film. To evaluate the removal of the low-k film, acarbon-doped silicon oxide (SiOCH) film having a thickness of about4,400 Å was formed on bare silicon wafers. To evaluate a removal rate ofthe protection film, a silicon carbonitride (SiCN) film having athickness of about 3,400 Å was formed on bare silicon wafers.

Silicon wafers on which the carbon-doped silicon oxide (SiOCH) film orthe silicon carbonitride (SiCN) film was formed were respectivelyimmersed in the compositions prepared in Examples 1 through 13 andComparative Example 1 for about 30 minutes, and then the silicon waferswere rinsed using deionized water for about 1 minute. Additionally, thesilicon wafers were completely dried using nitrogen gas. The success ofthe removal of the carbon-doped silicon oxide (SiOCH) film and theremoval rate of the silicon carbonitride (SiCN) film were evaluatedusing the naked eye, an optical microscope, a thin film thicknessmeasuring device, and a scanning electron microscope (SEM). F20 (tradename; manufactured by Filmetrics Co., Ltd., U.S.A.) was used as the thinfilm thickness measuring device, and S-4700 (trade name; manufactured byHitachi Co., Ltd., Japan) was used as the SEM. The success of theremoval of the carbon-doped silicon oxide (SiOCH) film and the removalrate of the silicon carbonitride (SiCN) film are shown in Table 2. InTable 2 “O” means that the film was successfully removed by thecomposition, and “X” means that the film was not successfully removed bythe composition.

TABLE 2 Removal State of Removal Rate of SiCN SiOCH [Å/30 min] Example 1◯ <250 Example 2 ◯ <100 Example 3 ◯ <100 Example 4 ◯ <100 Example 5 ◯<100 Example 6 ◯ <100 Example 7 ◯ <100 Example 8 ◯ <100 Example 9 ◯ <100Example 10 ◯ <100 Example 11 ◯ <100 Example 12 ◯ <100 Example 13 ◯ <100Comparative X X Example 1

As shown in Table 2, the compositions comprising an oxidizing agent,which were prepared in Examples 1 to 13 in accordance with embodimentsof the invention, removed the carbon-doped silicon oxide (SiOCH) filmand the silicon carbonitride (SiCN) film efficiently. However, thecomposition that did not comprise the oxidizing agent, which wasprepared in Comparative Example 1, did not remove the carbon-dopedsilicon oxide (SiOCH) film or the silicon carbonitride (SiCN) film.Therefore, it was confirmed that compositions that comprise an oxidizingagent, in accordance with embodiments of the invention, might remove thecarbon-doped silicon oxide (SiOCH) film and the silicon carbonitride(SiCN) film more effectively.

In addition, the silicon carbonitride (SiCN) film removal rates, inaccordance with the type(s) of oxidizing agent used, were compared withone another. Each of the compositions prepared in Examples 1 to 13removed the silicon carbonitride (SiCN) films at a rate of less thanabout 100 Å/30 min or less than about 250 Å/30 min. Particularly, thecompositions prepared in Examples 2 to 13 had removal rates of less thanabout 100 Å/30 min and the composition comprising ammonium persulfate asthe oxidizing agent, which was the composition prepared in Example 1,had a removal rate less than about 250 Å/30 min. Therefore, it was notedthat the composition comprising a peroxy acid compound such as ammoniumpersulfate might remove the silicon carbonitride (SiCN) film moreeffectively than a composition comprising one or two types of oxidizingagents other than a peroxy acid compound.

Evaluation of Removal Time of an Insulation Layer

The amount of time required to remove a carbon-doped silicon oxide(SiOCH) film and the amount of time required to remove a siliconcarbonitride (SiCN) film were evaluated for the compositions prepared inExample 1, Examples 14 through 37, and Comparative Example 1.

The carbon-doped silicon oxide (SiOCH) film and the silicon carbonitride(SiCN) film were formed by processes substantially the same as thosedescribed above with reference to the evaluation of the insulation layerremoval rates.

After the silicon wafers on which a carbon-doped silicon oxide (SiOCH)film or a silicon carbonitride (SiCN) film was formed were immersed inthe compositions prepared in Example 1, Examples 14 through 37, andComparative Example 1, respectively, for a predetermined amount of time,the silicon wafers were rinsed using deionized water for about 1 minute.The silicon wafers were also completely dried using nitrogen gas. Then,whether or not the carbon-doped silicon oxide (SiOCH) film and thesilicon carbonitride (SiCN) film were completely removed was determinedfor each wafer. Also, the amount of time required to completely removethe carbon-doped silicon oxide (SiOCH) film or the silicon carbonitride(SiCN) film was measured. Removal of the carbon-doped silicon oxide(SiOCH) film or the silicon carbonitride (SiCN) film was confirmed usingthe naked eye, an optical microscope, a thin film thickness measuringdevice, and a scanning electron microscope (SEM). F20 (trade name;manufactured by Filmetrics Co., Ltd., U.S.A.) was used as the thin filmthickness measuring device, and S-4700 (trade name; manufactured byHitachi Co., Ltd., Japan) was used as the SEM. The removal time for thecarbon-doped silicon oxide (SiOCH) film and the silicon carbonitride(SiCN) film is shown in Table 3.

TABLE 3 Removal Time of a Removal Time of a SiOCH Film [min] SiCN Film[min] Example 1 <10 270 Example 14 <20 >10 hr Example 15 <20 >10 hrExample 16 <20 >10 hr Example 17 <20 >10 hr Example 18 <15 400 Example19 <10 90 Example 20 <10 40 Example 21 <10 20 Example 22 <10 7 Example23 <15 250 Example 24 <10 90 Example 25 <10 50 Example 26 <10 25 Example27 <10 10 Example 28 <10 7 Example 29 <10 80 Example 30 <10 40 Example31 <10 15 Example 32 <10 90 Example 33 <10 150 Example 34 <10 170Example 35 <10 110 Example 36 <15 500 Example 37 <15 550 Comparative NotRemoved Not Removed Example 1

Evaluation of Removal Time of an Insulation Layer Depending on Contentand Type of a Fluorine-Containing Compound

To evaluate insulation layer removal time in accordance with thepercentage by weight of a fluorine-containing compound, the compositionsprepared in Examples 18 through 22 (referred to hereafter as Group I)were compared with one another. Each composition in Group I comprised asubstantially similar type of oxidizing agent, a substantially similarpercentage by weight of the oxidizing agent, and a substantially similartemperature compared to the other compositions in Group I. To evaluatean insulation layer removal time in accordance with the type offluorine-containing compound that the composition comprised, thecompositions prepared in Examples 35 through 37 (referred to hereafteras Group II) were compared with one another. Each composition in GroupII comprised substantially the same percentage by weight of thefluorine-containing compound, type of oxidizing agent, percentage byweight of the oxidizing agent, and temperature.

As shown in Table 3, removal times for the silicon carbonitride (SiCN)film were reduced in accordance with an increase in the percentage byweight of the fluorine-containing compound in Group I. Also, as shown inTable 3, the removal times for the carbon-doped silicon oxide (SiOCH)film were less when the percentage by weight of the fluorine-containingcompound in the compositions of Group I was greater than 1 percentcompared to when the percentage by weight was one percent. Inparticular, when the content of the fluorine-containing compoundincreased from about 1 percent by weight to about 30 percent by weight,the removal time of the silicon carbonitride (SiCN) film was greatlyreduced from about 400 minutes to about 7 minutes.

In Group II, the composition comprising hydrogen fluoride as thefluorine-containing compound, which was prepared in Example 35, rapidlyremoved the carbon-doped silicon oxide (SiOCH) film and the siliconcarbonitride (SiCN) film compared to the compositions comprisingammonium fluoride or ammonium bifluoride as the fluorine-containingcompound, which were prepared in Examples 36 and 37, respectively.Particularly, the composition comprising hydrogen fluoride as thefluorine-containing compound, which was prepared in Example 35, removedthe silicon carbonitride (SiCN) film was much more quickly than thecompositions comprising ammonium fluoride or ammonium bifluoride as thefluorine-containing compound, which were prepared in Examples 36 and 37,respectively.

Evaluation of Insulation Layer Removal Time in Accordance with the Typeof an Oxidizing Agent

To evaluate insulation layer removal time in accordance with theexistence or absence of an oxidizing agent, the compositions prepared inExample 1 and Comparative Example 1 (referred to hereafter as Group III)were compared with each other. To evaluate insulation layer removal timein accordance with the type of oxidizing agent, the compositionsprepared in Examples 14 through 17 and Example 25 (referred to hereafteras Group IV) were compared with one another. To evaluate removal time ofan insulation layer in accordance with types of a peroxy acid, thecompositions prepared in Examples 29, 32, and 33 (referred to hereafteras Group V) were compared with one another.

In Group III, the composition that did not comprise the oxidizing agent,which was prepared in Comparative Example 1, removed very little of thecarbon-doped silicon oxide (SiOCH) film or the silicon carbonitride(SiCN) film, even after one day had passed. However, the compositioncomprising ammonium persulfate as the oxidizing agent completely removedthe carbon-doped silicon oxide (SiOCH) film and the silicon carbonitride(SiCN) film within about 10 minutes and within about 270 minutes,respectively.

FIG. 5 is an SEM picture showing a surface of a substrate from which asilicon carbonitride (SiCN) film was removed using the compositionprepared in Example 1. FIG. 6 is an SEM picture showing a surface of asubstrate after the composition prepared in Comparative Example 1 wasapplied to the substrate, on which a silicon carbonitride (SiCN) filmwas formed.

Referring to FIGS. 5 and 6, the composition prepared in ComparativeExample 1 did not remove the silicon carbonitride (SiCN) film, and thesilicon carbonitride (SiCN) film remained on the silicon wafer. However,the silicon carbonitride (SiCN) film was completely removed from thesilicon wafer by the composition prepared in Example 1, and the siliconwafer was thereby exposed. Furthermore, the silicon wafer of FIG. 5 wasnot substantially damaged by the process of removing the siliconcarbonitride (SiCN) film. Therefore, it was confirmed that the siliconcarbonitride (SiCN) film might be removed without damaging the siliconwafer by properly adjusting the type and percentage by weight of thefluorine-containing compound, the type and percentage by weight of theoxidizing agent, and the temperature of the composition, and removaltime.

In Group IV, the compositions comprising hydrogen peroxide, nitric acid,sulfuric acid, or ammonium persulfate as the oxidizing agent, which wereprepared in Examples 14 through 17 and Example 25, removed thecarbon-doped silicon oxide (SiOCH) film within about 10 to 20 minutes.The silicon carbonitride (SiCN) film removal time for the compositionscomprising hydrogen peroxide, nitric acid, or sulfuric acid as theoxidizing agent, which were prepared in Examples 14 through 17, waslonger than about 10 hours. However, the composition comprising ammoniumpersulfate, which was prepared in Example 25, removed the siliconcarbonitride (SiCN) film in about 50 minutes. Therefore, it was notedthat the composition comprising the peroxy acid compound such asammonium persulfate as the oxidizing agent might rapidly remove thesilicon carbonitride (SiCN) film.

In Group V, insulation layer removal time was evaluated in accordancewith the types of the peroxy acid compound. The compositions comprisingammonium persulfate, sodium persulfate, or potassium persulfate, whichwere prepared in Examples 29, 32, and 33, removed the carbon-dopedsilicon oxide (SiOCH) film and the silicon carbonitride (SiCN) filmwithin a relatively short amount of time. In particular, the compositioncomprising the peroxy acid compound as the oxidizing agent removed thesilicon carbonitride (SiCN) film within about 80 to 150 minutes. Thus,it was confirmed that the composition comprising the peroxy acidcompound as the oxidizing agent removed the silicon carbonitride (SiCN)film much faster than the compositions comprising hydrogen peroxide,nitric acid, or sulfuric acid as the oxidizing agent.

Evaluation of Insulation Layer Removal Time in Accordance with thePercentage by Weight of Ammonium Persulfate

To evaluate insulation layer removal time in accordance with thepercentage by weight of ammonium persulfate, the compositions preparedin Examples 23 through 28 (referred to hereafter as Group VI) werecompared with one another. The types and percentages by weight of thefluorine-containing compound, and temperatures of the compositions weresubstantially the same for all of the compositions in Group VI.

In Group VI, the removal times for the carbon-doped silicon oxide(SiOCH) film and the silicon carbonitride (SiCN) film decreased as thepercentage by weight of ammonium persulfate increased. Particularly,removal time for the silicon carbonitride (SiCN) film was greatlyreduced from about 250 to 7 minutes as the content of ammoniumpersulfate increased from about 2 to 35 percent by weight.

Evaluation of Insulation layer Removal Time in Accordance with theTemperature of a Composition

Insulation layer removal time in accordance with the temperature of acomposition was evaluated for the compositions comprising ammoniumpersulfate as the oxidizing agent. The compositions prepared in Examples1, 25 through 27, 29 through 31, 34, and 35 (referred to hereafter asGroup VII) were compared with one another.

The temperatures of the compositions prepared in Examples 1, 34, and 35were maintained at about 50° C. The temperatures of the compositionsprepared in Examples 25 through 27 were maintained at about 80° C. Thetemperatures of the compositions prepared in Examples 29 through 31 weremaintained at about 70° C.

In Group VII, the carbon-doped silicon oxide (SiOCH) films were rapidlyremoved within about 10 minutes using the compositions havingtemperatures of about 50° C., about 70° C., or about 80° C. It wasconfirmed that removal time of the silicon carbonitride (SiCN) filmdecreased as the temperature of the composition increased from about 50°C. to about 80° C.

In accordance with embodiments of the invention, a composition mayeffectively remove an insulation layer such as a low-k film and aprotection film from a substrate. For purposes of economic efficiency,the substrate may be recycled by removing the insulation layer from thesubstrate using the composition. The insulation layer is removed througha wet etching process so that the damage caused to a substrate through adry etching process may be prevented. Furthermore, the cost of arecycling process may be reduced. Therefore, in accordance withembodiments of the invention, the efficiency of a semiconductormanufacturing process may be increased and the manufacturing cost may bedecreased.

Although embodiments of the invention have been described herein, thoseskilled in the art will readily appreciate that many modifications maybe made to the embodiments without materially departing from the scopeof the present invention as defined by the accompanying claims.

1. A composition adapted for removing an insulation material,comprising: about 1 to 50 percent by weight of an oxidizing agent; about0.1 to 35 percent by weight of a fluorine-containing compound; and,water, wherein the insulation material comprises silicon carbonitride(SiCN), and wherein the oxidizing agent comprises a peroxy acidcompound.
 2. The composition of claim 1, wherein the compositioncomprises: about 2 to 50 percent by weight of the oxidizing agent; and,about 1 to 35 percent by weight of the fluorine-containing compound. 3.The composition of claim 1, wherein the fluorine-containing compoundcomprises hydrogen fluoride.
 4. The composition of claim 3, wherein anamount of hydrogen fluoride is greater than or equal to about 5 percentby weight.
 5. The composition of claim 1, wherein the peroxy acidcompound comprises ammonium persulfate ((NH₄)₂S₂O₈).
 6. The compositionof claim 1, wherein the peroxy acid compound comprises at least onesubstance selected from the group consisting of ammonium persulfate,sodium persulfate, potassium persulfate, peroxynitric acid,peroxyphosphoric acid, peroxysulfuric acid, peroxyboric acid, sodiumperoxyborate, peroxyformic acid, peroxyacetic acid, peroxybenzoic acid,and peroxyphthalic acid.
 7. The composition of claim 1, wherein anamount of the peroxy acid compound is greater than or equal to about 5percent by weight.
 8. The composition of claim 1, wherein the oxidizingagent further comprises at least one substance selected from the groupconsisting of a peroxide compound, an oxy acid compound, a metal salt,and an acid.
 9. The composition of claim 1, wherein thefluorine-containing compound comprises at least one substance selectedfrom the group consisting of hydrogen fluoride, ammonium fluoride,ammonium bifluoride, sodium fluoride, sodium hydrogen fluoride, bariumfluoride, potassium fluoride, and ammonium fluoroborate.
 10. Thecomposition of claim 1, wherein the insulation material furthercomprises at least one low-k material selected from the group consistingof carbon-doped silicon oxide (SiOCH), silicon oxycarbide (SiOC), andhydrogenated silicon oxide (SiOH).
 11. The composition of claim 1,wherein the insulation material further comprises at least one substanceselected from the group consisting of silicon nitride (SiN), and siliconcarbide (SiC).
 12. A composition adapted for removing an insulationmaterial, comprising: about 1 to 50 percent by weight of a peroxy acidcompound; about 0.1 to 35 percent by weight of hydrogen fluoride; andwater, wherein the composition is employed in removing the insulationmaterial including at least silicon carbonitride (SiCN).
 13. Thecomposition of claim 12, wherein an amount of hydrogen fluoride isgreater than or equal to about 5 percent by weight.
 14. The compositionof claim 12, wherein an amount of the peroxy acid compound is greaterthan or equal to about 5 percent by weight.
 15. The composition of claim12, wherein the peroxy acid compound is at least one selected fromammonium persulfate, sodium persulfate, and potassium persulfate.